 |
| Home > Facilities |
| |
| Printing Room in Class 10,000 Area |
| |
 |
|
| |
|
 |
7 Printers with 4 x 6 & 4 x 4 inch standard format |
| |
|
|
DuPont Paste systems with PTH Technology |
| |
|
|
Infra Red Conveyor Dryer |
|
|
| |
| Firing Room : Class 10,000 Area |
| |
| |
|
|
3 BTU & 1 Watkinson Johnson Furnaces |
| |
|
|
High throughput on 12 inch belts |
|
|
 |
|
| |
| Laser Trimmers : Class 10,000 Area |
| |
 |
|
| |
|
| |
|
|
2 ESI Laser systems for active and passive trim |
| |
|
|
CO2 - Laser for substrate scribing |
|
|
| |
| Environmental Control |
| |
 |
|
| |
|
|
Temperature at 23 degree celsius and Relative
Humidity at 55% is controlled by
centralized Air Conditioning system . |
|
HEPA filters are provided for maintaining
total Dust Free environment. |
|
Class 10,000 & Class 100,000 areas |
|
|
| |
| ESD Control [IPC-A-610 (C)] |
| |
 |
|
| |
|
|
ESD safe flooring is provided through
out the facility. |
|
ESD safe work station with wrist
straps are provided. |
|
ESD safe storage trays are provided
to store components. |
|
ESD safe transfer pallets are used for
transporting material. |
|
|
| |
| S M T Facility |
| |
|
Solder printing on board of size 250x250 mm with vision system for fine pitch printing. |
|
Pick and place system with vision head for fine pitch QFP/PLCC up to 12 mil pitch and components of size 0402. Placement speed 4500 comp per hour and placement accuracy 50 micron & 1.5 degree. |
|
Computer controlled solder reflow system with 5 zone forced air convection heating capable of reflowing double sided boards. |
|
Wave soldering up to a board size of 300 mm |
|
ATE for high volume production and Manual Test facility for prototype & low volume work with standard test equipment such as Digital/Storage Oscilloscopes, Programmable Power Supplies, Network Analyzers etc. |
|
Qualified test engineers to formulate test procedures and fault diagnosis. |
|
| |
| Hybrid Microcircuit Fabrication |
| |
|
Thick film printing - up to 6 x 6 inch substrate of 25 or 40 mil thickness with PTH & double side printing |
|
Firing at 950 deg C in microprocessor controlled , 8 zone conveyor belt furnace. |
|
Computer Controlled Laser System for Resistor Trimming to a tolerance up to 0.5 % and functional trimming. Separate Laser System for substrate scribing. |
|
Gold Wire Bonding, Aluminum Wire bonding for high power applications. |
|
Seam Sealing with Fine leak and gross leak detection capability |
|
Screening of hybrids as per MIL/ISRO standards |
|
| |
| Chip & Wire bond hybrid facility |
| |
|
Clean Room : Class 10,000 area 1000 Sq.Meter |
|
Thick Film Processing : Precision Screen printers, Multi-Zone Furnace, Laser trimming & Scribing systems. |
|
Assembly : Semi Automatic Bonders for for Gold wire, Aluminum wire & Gold ribbon |
|
Packaging : Computer controlled machines for Hermetic sealing of hybrids |
|
Testing : Standard test equipment for electrical testing of all types of analog & digital circuits |
|
Screening : Burn in chambers, Thermal Cycling chambers & Constant Acceleration test units. |
|
| |
| Chip & Wire Bonding and Testing
|
| |
 |
|
| Separate Area for MIL / Space Products (Class 10,000 ) |
| Equipments |
|
Gold Wire Bonders |
|
Seam Sealing Equipment |
|
Al Wire and Au Ribbon Bonders |
|
| |
|
|
 |
|
| Test Facilities
|
|
Fine and Gross Leak Testers |
|
Bond Pull Testers |
|
Temp. Cycle ( - 70 to + 250 ) |
|
Burn-in’ Chamber |
|
Constant Acceleration Testers |
|
|
| |
